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H1600HF

特性/ Features

CTI≥600

Not recommended for solder mask rework

 

应用领域/ Applications 

Power base board、TV、Refrigerator、Washing machine,etc.

 

主要特性 / General properties

Item

  IPC-TM-650

Test Condition

Unit

Typical value

Glass transition temp.

2.4.25

DSC

136

CTE,Z-axis

2.4.24

50~260℃,TMA

%

3.9

Decomposition Temp.

2.4.24.6

TGA

342

T288

2.4.24.1

TMA,unclad

min

2

Thermal stress

2.4.13.1

unclad

sec

>120

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.16

Peel Strength/18μm

2.4.8

as received

lb/in

8.5

after thermal stress

lb/in

8.5

Permittivity(RC50%)

2.5.5.9

C-24/23/50,1G

/

4.6

Loss tagent(RC50%)

2.5.5.9

C-24/23/50,1G

/

0.016

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

5.01*108

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

5.26*107

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

120

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

KV

57

Flexural strength

Warp

2.4.4

as received

MPa

570

Fill

2.4.4

as received

MPa

470

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC0 


u 
Specification sheet:IPC-4101/127, for reference only.

u  Above typical value is tasted from CCL1.0mm 7628*8,except Dk/Df,the typical value is only for reference,cannot be used as the basis for judgement.



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