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HW20-M2

FEATURES

Lead-free compatible Halogen free material

BT resin based material 

Lower X,Y/Z-axis CTE

High glass transition temperature, High heat resistance

Keeping high modulus in high temperature

White LED with high reflectance of visible light

Less discoloration after heat treatment and light irradiation

Good punching & Drilling ability


APPLICATIONS

Chip LED Substrates

IC Package

MINI LED

COB


GENERAL PROPERTIES

Item

Test method

Unit

HW20-M2

UL No.

-

-

E136069

Min Thickness

UL

mm

0.05

Tg

DMA

≥190

Td(5%loss)

10℃/min@N_2

380

T260

TMA

min

>60

T288

TMA

min

Thermal Stress

288℃, Solder dip

-

6 cycles pass

Z-axis CTE

Before Tg

PPM/

30

After Tg

PPM/

180

50-260

%

1.8

X/Y-axis CTE

Before Tg

PPM/

11-13

After Tg

PPM/

5-10

Thermal conductivity

A

W/(m·k)

0.7

Moisture Absorption

D-24/23

%

<0.1

Dk

10GHz

-

5.2

Df

10GHz

-

0.02

Dielectric Breakdown

D-48/50+D-0.5/23

KV

45KV/mm

Reflectance(@457nm)

A

%

90%

180℃4H after baking

80%

UV(@385nm*1000H)

Dielectric constant

1 GHz, C-24/233/50

-

5.8

Peel Strength (LW/CW)

A

N/mm

≥0.80 N/mm(@T oz)

288℃/10S

≥0.80N/mm(@T oz)

Bending strength (LW/CW)

A

Mpa

480/480

Volume Resistivity

After moisture

MΩ-cm

E-24/125

Surface resistivity

After moisture

MΩ

E-24/125

Young’s modulus

LW

Gpa

23

CW

Gpa


Line up of laminate

Thickness(mm)

Thickness Tolerance(mm)

Glass fabrics ply

Cooper Foil

Standard Size

0.050

0.050±0.005

2*1027

 

 

 

 

12μm

18μm

35μm

70μm

37” *49”

41” *49”

43” *49”

 

0.065

0.065±0.005

2*1037

0.100

0.100±0.010

2*1078

0.150

0.150±0.010

2*1078

0.200

0.200±0.010

2*2116

0.300

0.300±0.010

3*2116

0.400

0.400±0.010

4*2116

0.500

0.500±0.015

3*2116

0.600

0.600±0.020

4*2116

1.000

1.000±0.030

6*2116

1.500

1.500±0.030

8*7628

 

Glass fabric

Resin Content

Presumed Thickness

(Inner copper remaining ratio is 100%)

#1037

72%

0.04mm

78%

0.05mm

#1067

72%

0.05mm

77%

0.06mm

#1078

64%

0.06mm


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