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H1170

FEATURES

Low water absorption

Excellent thermal reliability

Anti-CAF capability


APPLICATIONS

Power suppliers

Back panel,network

Industrial


GENERAL PROPERTIES

Item

  IPC-TM-650

Test Condition

Unit

Typical value

Glass transition temp.

2.4.25

DSC

185

CTE,Z-axis

2.4.24

α1,TMA

ppm/

45

α2,TMA

ppm/

270

50~260℃,TMA

%

2.9

Decomposition Temp.

2.4.24.6

TGA

360

T288

2.4.24.1

TMA,copper clad

min

30

Thermal stress

2.4.13.1

Copper clad

sec

>120

unclad

sec

>180

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.1

Peel Strength/18μm

2.4.8

as received

lb/in

6.5

after thermal stress

lb/in

6.5

Permittivity(RC50%)

2.5.5.9

C-24/23/50,1G

/

4.4

Loss tagent(RC50%)

2.5.5.9

C-24/23/50,1G

/

0.016

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

3.20*108

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

9.80*107

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

122

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

kV

58

Flexural strength

Warp

2.4.4

as received

MPa

565

Fill

2.4.4

as received

MPa

455

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC3

 

u  Specification sheet:IPC-4101/126/101/99/98, for reference only.

u  Above typical value is tasted from CCL1.0mm 7628*5,except Dk/Df,the typical value is only for reference,cannot be used as the basis for judgement.


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